Space Grade microComp Series

Space Grade microComp® Series

High density lightweight I/O connector

  • Optimized design and composite or aluminum shell for weight saving / 65% weight saving compared to standard HD D-Sub
  • Miniature solution for maximum space saving on panel / 35% size saving compared to standard HD D-Sub
  • Ease of use : removable  & protected contacts, easy mating / unmating / 38 % easier than standard HD D-Sub with 33% more contacts
  • Non magnetic, non outgassing
  • ESCC 3401 QPL

Key features and benefits


Miniature Space Grade microComp® Series is a QPL rectangular interconnect solution based on ESCC 3401 design.

Technical Data

  • Very High Density from 7 to 104 ways
  • #26 contacts, up to 2,5 A each
  • crimp & straight or 90° PC tail contacts
  • High speed network for Cat 5e Gigabit Ethernet 1000 base T links
  • QPL on ESCC 3401/081, 3401/082, 3401/083, 3401/084

Examples of application field

Space grade microComp connectors are based on ESCC 3401 design for space applications.